JONES Thermal Grease 21-430SF
JONES 21-430SF is a silicone-free thermal grease with a thermal conductivity of 3 W/m·K. Designed for high-performance applications, it provides low thermal resistance and wetting under pressure for CPUs, GPUs, and LED modules.
21-430SF Features
- Thermal conductivity: 3 W/m·K
- Moderate viscosity and easy application
- Silicone-free and solvent-free
- Excellent thermal reliability
21-430SF Applications
- CPUs and GPUs
- LED solid-state lighting
- Notebook and server processors
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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|
Properties |
Thermal Grease 21-430SF |
Test Method |
|
|
Thermal |
Thermal Conductivity (W/m·K) |
3.0 |
ASTM D5470 |
|
Thermal Resistance @40 psi (°C·cm^2/W) |
0.153 |
ASTM D5470 |
|
|
Operating Temperature Range(°C) |
-40~125 |
JONES Test Method |
|
|
Physical |
Color |
Grey |
Visual |
|
Composition |
Ceramic&Silicone-free |
- |
|
|
Typical Minimum Bondline Thickness (μm) |
25 |
JONES Test Method |
|
|
Viscosity @20rpm (Pa·s) |
150 |
ASTM D2196 |
|
|
Density (g/cm³) |
2.3 |
ASTM D792 |
|
|
Electrical |
Breakdown Voltage (KV AC /mm) |
>12 |
ASTM D149 |
|
Volume Resistivity (Ohm·cm) |
10^12 |
ASTM D257 |
|
|
Dielectric Constant @1MHz |
4.8 |
ASTM D150 |
|
|
Regulatory |
Flame Rating |
V0 |
UL 94 |





