JONES 21-869-100-0660 is an ultra-soft, putty-like thermal gap filler rated at 7.0 W/m·K. Its naturally tacky surface and high conformability make it ideal for uneven or rough surfaces requiring over 50% compressibility, ensuring excellent thermal contact and minimal component stress.
21-869-100-0660 Features
Thermal conductivity: 7.0 W/m·K
Ultra-soft, putty-like material
High surface wetting and compressibility
High breakdown voltage
Easy handling and installation
21-869-100-0660 Applications
Memory modules
Mass storage devices
Automotive electronics
Telecommunication hardware
Radios and power electronics
Set-top boxes
IT infrastructure
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
