JONES 21-745 Phase Change Interface Thermal Pad
JONES 21-745 is a phase change thermal interface material designed to reduce thermal resistance and improve heat sink efficiency. Solid at room temperature for easy handling, it activates at 50 °C, filling surface irregularities for enhanced thermal contact.
21-745 Features
- Phase change temperature: ~50 °C
- Minimizes bond-line thickness
- Excellent wetting and thermal contact
- RoHS compliant
21-745 Applications
- CPUs (Notebook, Desktop, Server)
- Chipsets and GPUs
- ASICs and smartphones
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
Material Properties - 21-745
| Category | Properties | Value | Test Method |
|---|---|---|---|
| Thermal | Thermal Conductivity (W/m·K) | 5.8 | Hot Disk |
| Thermal Conductivity (W/m·K) | 4.4 | ASTM D5470 | |
| Thermal | Thermal Resistance (°C·cm²/W) | 0.060 | ASTM D5470 |
| Thermal | Phase Change Softening Temp. (°C) | ~50 | ASTM D3418 |
| Thermal | Operation Temperature Range (°C) | -40~125 | JONES Test Method |
| Physical | Color | Grey | Visual |
| Standard Thickness (mm) | 0.20-1.00 | ASTM D374 | |
| Density (g/cm³) | 2.6 | ASTM D792 | |
| Electrical | Volume Resistivity (Ohm·cm) | 1012 | ASTM D257 |
| Surface Insulation Resistance (Ohm) | 108 | IPC-TM-650 | |
| Regulatory | Flammability Rating | V0 | UL 94 |
Notes:
- ASTM = American Society for Testing and Materials
- UL = Underwriters Laboratories
- IPC = Association Connecting Electronics Industries
- V0 = Highest flammability rating (self-extinguishing)
- All values are typical and may vary by application
