NP545 is a no-clean, zero-halogen solder paste formula designed for consistency and repeatability. NP545 consistently delivers paste transfer efficiencies of 0.55 to 0.50 AR. This paste is also fully capable of printing and reflowing 01005 components, even in air reflow, with minimal grasping behavior. NP545 is classified as ROL0 per IPC J-STD-004B. NP545 is has been developed as an SnPb alloy solder paste can use in backward applications and is thus fully compatible with soldering complex lead-free component on SnPb assemblies.

FEATURES:

ROL0 per J-STD-004B
Zero-Halogen (none intentionally added)
Consistent print performance to 0.5AR
Excellent cosmetics and a clear residue

Typical Properties

Property	Value	Test per	Method
Initial Tackiness	35 grams	J-STD-005, IPC-TM-650	2.4.44
Cold Slump Test	Pass	J-STD-005, IPC-TM-650	2.4.35
Solder Ball Test	Pass	J-STD-005, IPC-TM-650	2.4.43
Viscosity (typical)	1250 poise	J-STD-005, IPC-TM-650	2.4.35
Hot Slump Test	Pass
Wetting Test	Pass	IPC-TM-650	2.4.45

Resources

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