L37-3F is an ultra thin silicone based thermal interface pad which offers a good combination of high dielectric breakdown voltage, compliance and low thermal impedance. It contains a fibreglass mesh for enhanced ease of manufacture and is available in various formats such as standard sheets, log-rolls and custom die cut parts. L37-3F is available in a range of thicknesses and with one or two sided thermally conductive adhesive pre-applied.
FEATURES
Made of silicone, thermal conductive particles, fibreglass
Low elongation
Electrical insulation
Easy to assemble
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
