Almit Lead-Free Solder Pastes – consistent high quality and premium wetting properties. The flux contains a highly efficient wetting agent based on natural resin, the natural water content of which has been dehydrated through a special process. This serves to reduce the danger of tin and flux agent spit back, a troublesome problem that can lead to short-circuit bridges and reduced quality. The unique flux provides for fault-free and efficient soldering, even on oxidized component connections. The patented active flux components are faster than others in eliminating the oxide layer and provide for an extremely fast wetting of connection.

This level of quality is achieved through Almit”s proven consistency. Less solder wire is consumed while producing more output at even reduced reject rates. This results in increased productivity at lower costs.

FEATURES:

• Fusion point 210-225°C
• 100% halide-free
• Improve continuous printing & stable deposit
• Upgrade wetting of fine powder
• Minimize solder ball
• Flux agent L0 classified
• Available in particle size 4,5