Constant quality and premium wetting properties are the characteristics that are typical for Almit Solder Pastes. Only the best and purest of material with uniform particle sizes are processed. This ensures that the features of the paste are always uniform, thus guaranteeing that always the same amount is applied to the stencil plate without having to readjust the stencil printer. The unique, patented paste composition efficiently eliminates the problem of paste sticking in the plate apertures, even in fine and super fine pitch below 0.5 mm structures. In the presence of shear forces, the paste demonstrates exceptionally low-friction properties, comparable to those of graphite. Thanks to the paste”s strong thixotrophic properties, it retains its precise form after the stencil plate is lifted off after the print. Nevertheless, the solder paste displays sufficient adhesiveness for the components to be adequately retained on the pads, even with the strong acceleration forces that are generated by some of the fastest placement machines acting on them.
FEATURES:
- Fusion point 179 – 190°C
- Long open time and very good adhesiveness
- Particle sizes 25-45µm
- Flux agent L1 classified, “No clean”
- Flux agent content 9.5%
- Transparent colorless flux agent residues
- Available in 500g cans, 700g, 800g cartridges, 1.5kg cartridges
| Alloy Composition | Sn62.8-Ag0.4-Pb36.8 |
| Flux agent | L1 classified, No-Clean |
| Flux content | 9.5% |
| Color | Transparent |
| Particle size |
20-38µm 25-45µm |
| Fusion point | 179 – 190°C |
