LiPOLY® D2000 Two-Part Thermal Grease
D2000 is a reworkable, two-part thermal grease that cures quickly and delivers long-term reliability without dry-out or pump-out. It features 2.0 W/m*K thermal conductivity and is suitable for precision dispensing.
D2000 Features
- Thermal conductivity: 2.0 W/m*K
- No pump-out or dry-out
- Thin bond line and low thermal resistance
D2000 Applications
- CPUs and heat sinks
- Telecom hardware and mobile devices
- Mass storage and power modules
- 5G infrastructure, EV electronics
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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|
PROPERTY |
D2000 |
TEST METHOD |
UNIT |
|
Color |
White (A part) Gray (B part) |
Visual |
- |
|
Solid content |
100% (Two-part : 100:100 ) |
- |
- |
|
Viscosity A |
95 |
ISO 3219 |
Pa.s |
|
Viscosity B |
95 |
ISO 3219 |
Pa.s |
|
Density |
2.8 |
ASTM D792 |
g/cm³ |
|
Shelf life |
24 months |
- |
- |
|
ROHS & REACH |
Compliant |
- |
- |
|
SOLID(AFTER CURE) |
|||
|
Thermal conductivity |
2.0 |
ASTM D5470 |
W/m*K |
|
Thermal impedance@2mils BLT |
0.042 |
ASTM D5470 |
°C-in²/ W |
|
Bond line thickness |
50 |
- |
μm |
|
Hardness |
75 |
ASTM D2240 |
Shore OO |
|
Heat capacity |
1.0 |
ASTM E1269 |
J/g*K |
|
Volume resistivity |
>10¹² |
ASTM D257 |
Ohm-m |
|
Dielectric breakdown |
14 |
ASTM D149 |
KV/mm |
|
Working temp (long term) |
-60 ~ 200 |
- |
°C |
|
Working temp (short term) |
288 |
- |
°C |
|
Operating ambient temp |
20 ~ 30 |
- |
°C |
|
CURE SCHEDULE |
|||
|
Pot life @ 25°C |
10~15 |
By LiPOLY |
min |
|
Surface dry @ 25°C |
25~30 |
By LiPOLY |
min |
|
Cure @ 25°C |
35~40 |
By LiPOLY |
min |
|
Cure @ 100°C |
80 |
By LiPOLY |
sec |
|
Cure @ 120°C |
30 |
By LiPOLY |
sec |
