LiPOLY® TPS586/TPS5868 Thermal Gap Fillers
TPS586 and TPS5868 are two-part thermally conductive sealants with 1.5 and 3.0 W/m*K conductivity. They offer high deformation capability and are suitable for gap coverage and vibration dampening.
TPS586/TPS5868 Features
- Thermal conductivity: 1.5 / 3.0 W/m*K
- Waterproof and vibration dampening
- Easy dispensing two-part system
TPS586/TPS5868 Applications
- Automotive electronics
- 5G infrastructure, EVs, and telecom
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
Typical Properties
|
PROPERTY |
TPS586 |
TPS5868 |
TEST METHOD |
UNIT |
|
Color |
White (A part) Gray (B part) |
White (A part) Gray (B part) |
Visual |
– |
|
Resin base |
Silicone |
Silicone |
– |
– |
|
A:B |
100:100 |
100:100 |
– |
– |
|
Viscosity |
5.0 |
8.0 |
ISO 3219 |
Pa.s |
|
Density |
2.1 |
2.8 |
ASTM D792 |
g/cm³ |
|
Application temperature |
-60~180 |
-60~180 |
– |
°C |
|
Pot life |
25°C / 1.5 hr |
25°C / 1.0 hr |
By LiPOLY |
– |
|
Surface dry |
25°C / 2.0 hr |
25°C / 1.5 hr |
By LiPOLY |
– |
|
Curing condition 1 |
25°C / 2.5 hr |
25°C / 2.0 hr |
By LiPOLY |
– |
|
Curing condition 2 |
70°C / 25 min |
70°C / 20 min |
By LiPOLY |
– |
|
Curing condition 3 |
120°C / 1 min |
120°C / 1 min |
By LiPOLY |
– |
|
Hardness |
6 |
5 |
ASTM D2240 |
Shore A |
|
Shelf life |
24 months |
24 months |
– |
– |
|
ROHS & REACH |
Compliant |
Compliant |
– |
– |
|
ELECTRICAL |
||||
|
Dielectric breakdown |
14 |
14 |
ASTM D149 |
KV/mm |
|
Volume resistivity |
>10¹² |
>10¹² |
ASTM D257 |
Ohm-m |
|
THERMAL |
||||
|
Thermal conductivity |
1.5 |
3.0 |
ASTM D5470 |
W/m*K |
