TIA223G-DG is a 2-component, thermally conductive material for encapsulating, gap filling, and for use as a thermal path to heat sinks. The flowability of TIA223G-DG allows it to conform to complex 3-dimensional shapes and cavities in potting applications, while also enabling it to be transferred in a thin layer as a liquid-dispensed alternative to thermal pads.
TIA223G-DG quickly cures to a soft rubber gel with exposure to heat and will also cure at room temperatures.
KEY FEATURES
• Good thermal conductivity
• Fast cure with exposure to heat
• Easy to use 1:1 mixing ratio by weight or volume
APPLICATIONS
Thermal encapsulating, gap filling, and thermal interface to heat sinks in various electronic
components.
Đặc điểm | Gía trị |
Tỷ lệ trộn | 1:1 |
Màu | Xám đậm |
Điều kiện khô đề xuất | 0.5h @ 70°C 24h @ RT |
Độ nhớt [Pas] |
40 |
Thời gian thao tác @RT [h] | 0.5 |
Độ cứng [Thước A] | 20 |
T/C [Wm/K] |
2.1 |
Độ bền điện môi [kV/mm] |
20 |
Nhiệt độ hoạt động | -40°C to 200°C |