TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.

Key Features

Good thermal conductivity
Fast low-temperature cure
Retains softness after cure to enhance stress relief during thermal cycling
Easy to use 1:1 mixing ratio
Conforms to complex shapes of three-dimensional interface designs
Can be dispensed or printed
Repairable
Flame retardant: UL94V-0 equivalent

Applications

Thermal interface for electronic components in consumer, telecommunications, automotive, and lighting applications.

Typical Properties

Property		TIA225GF
Appearance		Xám
Density (23°C)	g/cm3	2.90
Thermal conductivity	W/(m·K)	2.5
Thermal resistance	mm2·K/W	35
Hardness (Type E)		20
Tensile strength	MPa	0.4
Elongation	%	70
Volume resistivity	MΩ∙m	6.0×106
Dielectric strength	kV/mm	20
CTE *3	ppm/K	120
Low volatile siloxane (D4 -D10)	ppm	200
Viscosity (23°C)	Pa・s	100
Mixing ratio (theo trọng lượng)		100:100
Viscosity after mixing (23°C)	Pa・s	100
Pot life	h	4
Curing condition (70°C) (23°C)	h h	0.5 24

Resources

TDS:Download

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