SilCool TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its non-slumping pasty consistency offers physical stability that can allow improved processing. SilCool TIA241GF gap filler can be used as a liquid dispensed alternative to pre-fabricated thermal pads in a broad array of thermal designs for electronic applications.
Key Features
- Good thermal conductivity
- Fast, low temperature cure
- Convenient 1:1 mix ratio by weight
- Retained softness after cure for enhanced stress relief during thermal cycling
- Excellent slump resistance (stays in place)
- Repairable
- Flame retardant: UL94V-0 equivalent
- Glass bead options available (180 & 250μm) for bond line thickness (BLT) control
Applications
Thermal interface for electronic components in Automotive, Consumer, Telecommunication, Lighting and Industrial applications.
Đặc điểm | SilCool TIA241GF (A) | SilCool TIA241 GF (B) |
Màu (thành phần A & thành phần B) | xanh | xanh nhạt |
Độ nhớt *1 Pa•s | 250 | 130 |
Tỷ lệ trộn theo trọng lượng | 1:1 | 1:1 |
Độ nhớt sau khi trộn Pa•s | 130 | 130 |
Chỉ số lưu biến | 2.6 | 2.6 |
Thời gian thao tác ở 23°C (giờ) | 3 | 3 |
Điều kiện khô (giờ) at 100 °C at 70 °C at 23 °C |
0.25 0.50 24 |
0.25 0.50 24 |