XE14-TM009 is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping pasty consistency provides physical stability for optimized processing. XE14-TM009 can be used as liquid dispensed alternative to prefabricated Thermal Pads, for a broad array of thermal designs in electronic applications.
KEY FEATURES
• High thermal conductivity
• Fast, low temperature cure
• Convenient 1:1 mix ratio by weight
• Retains softness after cure to contribute to stress relief during thermal cycling
• Good slump resistance (stays in place)
• Repairable
APPLICATIONS
Thermal interface for electronic components in Automotive, Consumer, Telecommunication,
Lighting and Industrial applications
Đặc điểm | XE14-TM009 (A) | XE14-TM009 (B) |
Màu (Part A & B) | hồng | hồng nhạt |
Độ nhớt *1 | 240 | 235 |
Tỷ lệ trộn theo trọng lượng | 1:1 | 1:1 |
Độ nhớt sau khi trộn | 275 | 275 |
Chỉ số lưu biến | 2.6 | 1.3 |
Thời gian thao tác @ 23°C (giờ) | 1 | 1 |
Điều kiện khô (giờ) @ 70°C @ 23°C |
1 24 |
1 24 |