LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive
LOCTITE® 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.
- One component – requires no mixing
- Very high wet strength
Cure Schedule Temperature (Step 1) | 150 |
Cure Schedule Temperature Unit (Step 1) | °F |
Cure Schedule Time (Step 1) | 90 – 120 |
Cure Schedule Time Unit (Step 1) | sec. |
Cure Type | Heat Cure |
Number of Components | 1 Part |
Physical Form | Gel |
Shear Strength Unit, Grit Blasted Steel | psi |
Shear Strength, Grit Blasted Steel | 2175 |
Storage Temperature | 35.6 – 46.4 °F |
Technology | Epoxy |
Viscosity | 20 – 50 Pa∙s |