Home > New Products > LOCTITE ABLESTIK EMI 8880S

LOCTITE ABLESTIK EMI 8880S

  • Product code: 8880S
  • Manufacturer: Henkel
  • Package size: 30ml
  • Shelf Life:

Request Quote Request Sample

LOCTITE ABLESTIK EMI 8880S is an electrically conductive adhesive designed to achieve robust electromagnetic interference (EMI) shielding performance with extremely thin coating thickness at a single micrometer level for package-level shielding applications. The material has robust adhesion to mold compound, epoxy, copper, gold, and silver surfaces.

When spray-coated, this material can be atomized to highly fine droplets for excellent uniformity at low to high coating thicknesses which can be controlled by equipment parameters.

FEATURES:

  • High electrical conductivity
  • High thermal conductivity
  • Sprayable
  • Good workability
  • Long work life
  • Excellent adhesion on mold compound and epoxy surfaces
  • Excellent adhesion to copper, gold and silver

APPLICATIONS:

  • Radiofrequency (RF)
  • Wireless components
  • Memory
  • Sensors
  • Other sensitive devices

APPLYING METHODS:

  • Spraying
  • Printing
  • Dispensing
Công nghệ Phun phủ
Dạng keo Chất lỏng màu bạc
Cơ chế khô Khô bằng nhiệt
Ứng dụng Chất bán dẫn, lớp phủ
Dạng chất làm đầy Bạc

CÁC TÍNH CHẤT CƠ BẢN CỦA VẬT LIỆU

Độ nhớt, Brookfield, 25 °C, mPa·s (cP):
Spindle 18, Speed 5 rpm		 530
 (0.5/5 rpm) 2.7
Thời gian tra keo tối đa @ 25°C, giờ 24
Điều kiện khô khuyên dùng 60 minutes @ 175°C
Điện trở kháng, ohm-cm 5.00×10^-6
Khả năng chắn nhiễu @ 5 µm coating thickness , dB: @ 2.6 to 3 GHz: 92

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    Protective tape for semiconductor industries
    https://prostech.ph/protective-tape-for-semiconductor-industries/

    The die and other components are exposed to high temperatures or harsh environments during the production process. Prostech provides a
    Semiconductor Packaging
    https://prostech.ph/semiconductor-packaging/

    ChallengeChiplet design – a response and a driver for smaller, thinner chipsSolutionVersatile carrier tapes and cover tapes for semiconductor transport
    Chip Molding in Semiconductor
    https://prostech.ph/chip-molding-in-semiconductor/

    Challenges SolutionsLiquid encapsulantsEpoxy molding compound Challenges Solutions Liquid encapsulants Encapsulants are the last piece of the IC package and serve
    FAQs of Epoxy Mounding Compound
    https://prostech.ph/faqs-of-epoxy-mounding-compound/

    What do we mean by good electrical stability?What causes poor electrical stability in mold compounds?EMC subcomponents have high ionic contentEpoxy

    Outstanding Feature Product Group