LOCTITE ABLESTIK GA2W is a single component adhesive is designed for CCD/CMOS die attach bonding applications. This adhesive can be cured using directed heat energy or hot plate curing techniques.
FEATURES:
- Very low stress
- Low chip warpage
- Improved viscosity
- Thixotropic
- Good dispensability
- One component
RECOMMENDED APPLICATIONS:
- Compact Camera Module – Die attach
Cure Type | Heat |
Appearance | Ivory |
Viscosity (Brookfield) 25°C, 5 rpm | 10,000 |
Glass Transition Temperature (Tg) | 25 |
Modulus @ 25°C | 70 |
CTE Below Tg | 58 |
CTE Above Tg | 164 |
Recommended Cure | 15 min. @ 175°C |