PF743 is made with the Sn-48Bi-Ag-y alloy that has been qualified by a third-party organization and has a melting point of 138°C (low temperature solder paste). PQ10 in comparison with SnAgCu:
FEATURES:
- Low-Temperature Solder Paste.
- Shenmao Technology has developed a Low-Temperature Solder Paste for SMT devices.
- The Low-Temperature Solder Paste has been qualified by third-party organizations.
- Reduced peak reflow temperature
- Reduced energy consumption
- Reduced warpage of PCB and components
- Solder Paste: Sn42Bi58
- Melting point: 138℃
- Finer bismuth phase
- Better drop test performance
- Better thermal cycle test performance
Alloy Composition | Sn-48Bi-Ag-y |
Melting Temperature ( ° C) | 137 – 155 |
Recommended Applying Method | Printing/ Dispensing |
Application | SMT |