Underfills can be used to help reinforce electronic components and minimize stress. They also offer excellent protection of solder joints during thermal cycling, provide reliability against stress
Popular types of underfill
Underfill CSP
Underfill BGA
Underfill WLCSP
Underfill LGA
Partial underfill
Materials characteristics for underfill:
Fast cure
Good flowability
High reliability
Good re-workability
Excellent SIR performance
Main benefits:
Improve reliability performance
Enhancing mechanical performance
Encapsulation
Encapsulation is a method to place on or around circuit boards and components to provide protection against particles, heat, moisture, and other external pressures.
PCB encapsulation solutions include epoxy, silicone, urethane, and acrylic chemistries that provide manufacturing flexibility across applications.
Typical types of encapsulation:
Flip-chip
CSP
BGA
Materials characteristics:
Highly flowable
Excellent jet dispensing performance
Precise rheology control to meet specified flow requirement
Precise thixotropic for dot shape control
UV detectable
Fast cure and dual curing mechanism for ultimate versatility
High SIR after 85C/85RH conditioning (1wk)
High bias voltage
Suitable for harsh environments
Survive lead-free reflow
Main benefits:
Better reliability and mechanical performance
Moisture & heat resistance and stable electrical performance
For more information on how to choose materials for underfill and encapsulation applications, contact us:
