TIG830SP is a silicone grease that provides high thermal conductivity and low thermal resistance. The worability of TIG830SP makes it a good candidate for screen-printing and dispensing processes, and its thermal performance contributes to help solving heat dissipation challenges in a variety of electronic components and designs.
FEATURES:
- High thermal conductivity
- Low thermal resistance
- Thin bond lines
- Highly workable -excels in screen-printing and dispensing processes
- Wide operating temperature range (-40 °C ~ 150 °C)
- Minimal weight loss at elevated temperatures
- Minimal ionic impurities
APPLICATIONS:
Thermal Management
Property | Unit | Value |
Appearance | Gray paste | |
Specific Gravity (23 °C) | 2.88 | |
Unworked Penetration (1) (23 °C) | 360 | |
Viscosity (23°C) | Pa•s | 300 |
Bleed (150°C, 24h) | wt% | 0.0 |
Evaporation (150°C, 24h) | wt% | 0.3 |
Thermal Conductivity | W/m•K | 4.1 |
Thermal Resistance (3) (BLT: 45µm) | mm^2•K/W | 12 |
Volatile Siloxane (D 3 -D10) |
ppm | <100 |