TSE3062 is a two-component, low viscosity silicone gel designed for electronics potting applications. This product cures at room temperature to a soft, tacky gel with the addition of curing agent. The cure time can be accelerated with heat. The soft nature and cushioning effect of this product provides excellent protection for electronic assemblies from external humidity, mechanical shock and vibration.
Key Features
Convenient 1:1 mix ratio by weight
Low viscosity – easily pourable
Room temperature curable and heat accelerated cure
Soft, tacky gel
Absorbs shock and protects delicate mechanical components from vibration
No reactive by-products; non corrosive
Excellent electrical properties
Excellent resistance to temperature extremes
Applications
Electrical and electronic potting such as hybrid IC and power module
