TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.
FEATURES:
- Good thermal conductivity
- Fast low-temperature cure
- Retains softness after cure to enhance stress relief during thermal cycling
- Easy to use 1:1 mixing ratio
- Conforms to complex shapes of three-dimensional interface designs
- Can be dispensed or printed
- Repairable
- Flame retardant: UL94V-0 equivalent
Uncured Properties | Unit | TIA225GF(A) | TIA225GF(B) |
Appearance | Dark Gray | Light Gray | |
Viscosity (23°C) | Pa.s | 100 | 100 |
Mixing ratio (by weight) | 100:100 | ||
Viscosity after mixing (23°C) | hour | 100 | |
Pot life | hour | 4 | |
Cure condition (70°C) (23°C) |
hour |
0.5 24 |
Cured Properties(†) (0.5h at 70°C) | TIA225GF | |
Appearance | Gray | |
Density (23°C) | g/cm³ | 2.90 |
Thermal conductivity | W/(m·K) | 2.5 |
Thermal resistance (BLT: 50μm) | mm²·K/W | 35 |
Hardness (Type E) | 50 | |
Tensile strength | MPa | 0.4 |
Elongation | % | 70 |
Volume resistivity | MΩ∙m | 6.0×10^6 |
Dielectric strength | kV/mm | 20 |