TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.

FEATURES:

Good thermal conductivity
Fast low-temperature cure
Retains softness after cure to enhance stress relief during thermal cycling
Easy to use 1:1 mixing ratio
Conforms to complex shapes of three-dimensional interface designs
Can be dispensed or printed
Repairable
Flame retardant: UL94V-0 equivalent

Typical Properties

Uncured Properties	Unit	TIA225GF(A)	TIA225GF(B)
Appearance		Dark Gray	Light Gray
Viscosity (23°C)	Pa.s	100	100
Mixing ratio (by weight)		100:100
Viscosity after mixing (23°C)	hour	100
Pot life	hour	4
Cure condition (70°C) (23°C)	hour	0.5 24

Cured Properties(†) (0.5h at 70°C)		TIA225GF
Appearance		Gray
Density (23°C)	g/cm³	2.90
Thermal conductivity	W/(m·K)	2.5
Thermal resistance (BLT: 50μm)	mm²·K/W	35
Hardness (Type E)		50
Tensile strength	MPa	0.4
Elongation	%	70
Volume resistivity	MΩ∙m	6.0×10^6
Dielectric strength	kV/mm	20

Resources

TDS:Download

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