TSE325 silicone adhesive is a one-component heat-curable silicone adhesive designed for potting and encapsulation. This product adheres to many substrates without a primer and cures at elevated temperatures. This product has a very long working time at room temperature. TSE325 is a white, flowable material with self-leveling properties.
FEATURES:
- One component products – no mixing required
- Cure at elevated temperature
- Low viscosity – easily pourable
- Primerless adhesion to many types of substrates
- No cure by-products, low linear shrinkage
- Non-corrosive to metals and sensitive substrates
- Outstanding performance over a wide temperature range
APPLICATIONS:
- Encapsulation Materials for Automotive Electronics
Uncured Properties | ||
Appearance | White | |
Viscosity (23 °C) | Pa·s | 4000 |
Cured Properties (cured 1 hour at 150 °C) | ||
Density (23 °C) | g/cm³ | 1.02 |
Hardness (Type A) | 12 | |
Elongation | % | 200 |
Tensile Strength | MPa | 0.7 |
Adhesion Strength | MPa | 0.4 |
Dielectric Strength | kV/mm | 21 |
Dielectric Constant (60Hz) | 2.9 |