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Home > Products > By Manufacturer > Momentive > Momentive TSE3281-G Silicone Thermal Adhesive

Momentive TSE3281-G Silicone Thermal Adhesive

  • Product code: TSE3281-G
  • Manufacturer: Momentive
  • Package size: 1 kg can
  • Shelf Life:

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  • Typical Properties
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TSE3281-G silicone adhesive is a one component, medium viscosity, thermally conductive material, which cures to an elastomer when heat is applied. It is non-corrosive and has excellent adhesion properties to a wide variety of substrates without the need for using a primer.

FEATURES:

  • Good thermal conductivity properties
  • Adhesion to many substrates without the use of a primer
  • One component formulation for ease of handling
  • No cure by-products / low shrinkage allows for deep section application and use in enclosed assemblies
  • Good dielectric properties

Typical Properties

Property Unit Value
Appearance   Grey
Specific Gravity (23 °C)   2.7
Hardness (Type A)   84
Viscosity (23°C) Pa•s 60
Tensile Strength MPa 4.5
Elongation % 50
Adhesion Strength MPa 2.5
Dielectric Strength kV/mm 15
Dielectric Constant (60Hz)   5.2
Dissipation Factor (60 Hz)   0.002
Volume Resistivity Ω·cm 4.8×10^14
Thermal Conductivity W/m·K 1.68
Linear Expansion 1/K 1.4 x 10^(-4)

Resources

TDS:Download

Related Article

Thermally Conductive Adhesive
https://prostech.ph/thermally-conductive-adhesive/

What are Thermally Conductive Adhesives? See what PROSTECH provide for Thermal AdhesiveHow to choose the thermally conductive adhesive or glue?

How to choose heatsink compound and how to apply on PCB?
https://prostech.ph/how-to-choose-heatsink-compound-and-how-to-apply-on-pcb/

What is the purpose of a heat sink compound?How to choose?Chemical BaseMechanical ability Heat sink compound or grease is knowns

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