Prostech Philippines

Multi-Cure 9001-E-v3.1 encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. This encapsulant provides optimal coverage over difficult circuit geometries. 9001-E-v3.1 encapsulating material has high ionic purity, is solvent free, and isocyanate free. This encapsulant has been engineered to have a low modulus and low Tg to minimize stress on delicate wire bonds. Material exposed to light will cure in seconds, while any shadowed areas will cure upon heat exposure. 9001-E-v3.1 Visible/UV light-curable encapsulant is formulated for fast on-demand cure with the Dymax BlueWave® LED Prime UVA spot curing lamp and BlueWave® LED DX-1000 curing system.

Multi-Cure 9001-E-v3.1 encapsulant is especially well suited for chip-on-board, chip-on-flex, multi-chip modules and wire bonding.

APPLICATIONS:

Chip-on-board
Chip-on-flex
Chip-on glass
Wire bonding
Bare-die encapsulation

Uncured properties
Solvent content	None, 100% solids
Isocyanate content	None
Chemical class	Modified urethane
Appearance	Liquid
Color	Colorless
Solubility	Alcohols/Chlorinated solvents/Ketones
Viscosity (20rpm)	4,500 cP (nominal)

Cured mechanical properties
Physical	Value	Test method
Durometer hardness	D45 (nominal)	ASTM D2240
Tensile at break, MPa [psi]	750 psi	ASTM D638
Elongation at break, %	150%	ASTM D638
Modulus of Elasticity, MPa [psi]	2500 psi	ASTM D638
Water absorption (24h)	1.0%	ASTM D-570
Boiling water absorption (2h)	2.6%	ASTM D-570
Thermal limit	150°C	DSTM D-200*
Glass transition, Tg	40°C	DSTM 256*
Linear shrinkage	2%	ASTM D-2556

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Multi-Cure 9001-E-V3.1

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