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Multi-Cure 9001-E-V3.1

  • Product code: 9001-E-v3.1
  • Manufacturer: Dymax
  • Package size: 30 ml syringe
  • Shelf Life:

   

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Multi-Cure 9001-E-v3.1 encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. This encapsulant provides optimal coverage over difficult circuit geometries. 9001-E-v3.1 encapsulating material has high ionic purity, is solvent free, and isocyanate free. This encapsulant has been engineered to have a low modulus and low Tg to minimize stress on delicate wire bonds. Material exposed to light will cure in seconds, while any shadowed areas will cure upon heat exposure. 9001-E-v3.1 Visible/UV light-curable encapsulant is formulated for fast on-demand cure with the Dymax BlueWave® LED Prime UVA spot curing lamp and BlueWave® LED DX-1000 curing system.

Multi-Cure 9001-E-v3.1 encapsulant is especially well suited for chip-on-board, chip-on-flex, multi-chip modules and wire bonding.

APPLICATIONS:

  • Chip-on-board
  • Chip-on-flex
  • Chip-on glass
  • Wire bonding
  • Bare-die encapsulation

Typical Properties

Uncured properties 
Solvent content None, 100% solids
Isocyanate content None
Chemical class Modified urethane
Appearance Liquid
Color Colorless
Solubility Alcohols/Chlorinated solvents/Ketones
Viscosity (20rpm) 4,500 cP (nominal)

 

Cured mechanical properties  
Physical Value Test method
Durometer hardness D45 (nominal) ASTM D2240
Tensile at break, MPa [psi] 750 psi ASTM D638
Elongation at break, % 150% ASTM D638
Modulus of Elasticity, MPa [psi] 2500 psi ASTM D638
Water absorption (24h) 1.0% ASTM D-570
Boiling water absorption (2h) 2.6% ASTM D-570
Thermal limit 150°C DSTM D-200*
Glass transition, Tg 40°C DSTM 256*
Linear shrinkage 2% ASTM D-2556

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