Better wettability with good solder spread
The combination of activators in RX-300-NC accelerates the activation of soldering flux in the early stage of soldering process and prevents the gasification of activators at high temperature. The wide range of activation temperature gives excellent initial wettability and good solders spreading over the substrates to the RX-300-NC.
Fast soldering at QFP without solder bridging defect RX-300-NC gives excellent performance in linear soldering. The high-temp melting characteristic reduce the vaporization and maintain the sufficient quantity of soldering flux within substrate and part during the soldering process hence eliminate the bridging defects in linear soldering especially in QFP component.
