PERMABOND® ES558
PERMABOND® ES558 is a toughened, single-part epoxy paste that flows like solder during heat curing. It offers excellent shear, peel, and impact resistance and is suitable for bonding a range of materials including metals, ceramics, and composites.
PERMABOND® ES558 Features:
- Excellent adhesive strength
- Excellent resistance to vibration
- No mixing required
- High shear and peel strength
- Good impact strength
- High temperature resistance
- Good chemical resistance
PERMABOND® ES558 Applications:
- Bonding metals, ferrites, ceramics, and composites
- Electronics and automotive assemblies
- High-impact structural joints
- Thermal and chemically resistant bonding
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
Chemical composition | Epoxy Resin |
Appearance | Silver-grey |
Viscosity @ 25°C | 100,000 to 300,000 mPa.s (cP) |
Specific gravity | 1.5 |
Typical Curing Properties
Flow at high temperature | Free flow |
Maximum gap fill | 0.5 mm 0.02 in |
Cure speed (oven) * | 130° C (266°F): 75 minutes 150°C (300°F): 60 minutes 170°C (338°F): 40 minutes |
Cure speed (induction) | <3 minutes |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Steel 27 – 41 N/mm² (4000 – 6000 psi) Aluminium 17 - 31 N/mm² (2500 – 4500 psi) Zinc 14 - 27 N/mm² (2000 – 4000 psi) |
Shear strength steel to ferrite | >14 N/mm² (>2000 psi) Substrate failure |
Impact Strength (ASTM D- 950) | 25-35 KJ/m² |
Hardness (ISO868) | 80-85 Shore D |
E-modulus | 3.5 GPa |
Elongation at break (DIN 53504) | <3% |
Coefficient of thermal expansion | 45 x 10-6 mm/mm/°C (below Tg) 160 x 10-6 mm/mm/°C (above Tg) |
Thermal conductivity | 0.9 W/(m.K) |
Glass transition temperature (Tg – DSC)) | 120°C (250°F) |
