PERMABOND® ES560 is a single-part epoxy adhesive which flows when heated. It is unfilled and selflevelling, making it particularly suitable for electronics potting and encapsulation applications, as well as underfilling and reworking microchips. It withstands thermal cycling and has excellent shock resistance.

FEATURES:

Excellent adhesive strength
Excellent resistance to vibration
Easy to use – no mixing required
Low viscosity

Typical Properties

Chemical Composition	Epoxy Resin
Appearance	Uncured – white / opaque Cured – translucent
Viscosity	1,000-3,000 mPa.s (cp)
Specific Gravity	1.2

Resources

TDS:Download

Underfills for reinforcing Components on PCBs

https://prostech.ph/underfills-for-reinforcing-components-on-pcbs/

What is Underfill? Why underfill?Three types of Underfills 1. Full Underfill2. Corner bonding3. Edge bonding Materials and equipment for Underfill EquipmentMaterials What is Underfill?

Materials for Underfill and Encapsulation for PCB assembly

https://prostech.ph/materials-for-underfill-and-encapsulation-for-pcb-assembly/

UnderfillEncapsulation Underfill Underfills can be used to help reinforce electronic components and minimize stress. They also offer excellent protection of