PERMABOND® ES562
PERMABOND® ES562 is a heat-cured, single-part epoxy adhesive with excellent adhesion to metal and composite surfaces. It flows like solder during cure, has high bond strength, and its self-leveling property is ideal for smooth, uniform bonding.
PERMABOND® ES562 Features:
- Excellent adhesive strength
- Excellent resistance to vibration
- No mixing required
- High shear strength
- Low viscosity, self-leveling
- Good chemical resistance
PERMABOND® ES562 Applications:
- Electronic and metal assemblies
- Replacing soldering and brazing
- Precision and surface bonding
- Thermally conductive joints
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
Physical Properties of Uncured Adhesive
Chemical composition | Epoxy Resin |
Appearance | White |
Viscosity @ 25°C | 15,000 – 30,000 mPa.s (cP) |
Specific gravity | 1.2 |
Typical Curing Properties
Flow at high temperature | Free flow |
Maximum gap fill | 0.25 mm 0.01 in |
Cure speed (oven) * | 130° C (266°F): 60 minutes 150°C (300°F): 45 minutes 160°C (320°F): 20 minutes |
Cure speed (induction) | <3 minutes |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Steel 20 - 35 MPa (3000 – 5000 psi) Aluminium 14 - 27 MPa (2000 – 4000 psi) Zinc 14 - 27 MPa (2000 – 4000 psi) |
Tensile strength (DIN53504) | 40 N/mm² (5800 psi) |
Hardness (ISO868) | 80-85 Shore D |
E-modulus | 2.1 GPa |
Elongation at break (DIN53504) | <3% |
Coefficient of thermal expansion | 50 x 10-6 mm/mm/°C (below Tg) 165 x 10-6 mm/mm/°C (above Tg) |
Thermal conductivity | 0.25 W/(m.K) |
Glass transition temperature (Tg – DSC) | 115°C (240°F) |
Water absorption (ISO62) | <0.5% (at room temperature) |
