Prostech Philippines

PERMABOND ES568 is a versatile adhesive that provides exceptional adhesion to metal surfaces, ceramics, and composites. This heat cured epoxy adhesive is known for its durability and ability to withstand impact and vibrations.

FEATURES

Rapid cure speed
Excellent resistance to vibration
Easy to use – no mixing required
High shear and peel strength
High temperature resistance
Good resistance to chemicals

Physical Properties of Uncured Adhesive

Chemical composition	Epoxy Resin
Appearance	Ivory
Viscosity @ 25°C	20rpm: 40,000-65,000 mPa.s (cP) 2rpm: 45,000-75,000 mPa.s (cP)
Specific gravity	1.1

Typical Curing Properties

Flow at high temperature	Free-flowing
Maximum gap fill	0.5 mm 0.02 in
Cure speed (oven) *	135°C (275°F): 35 minutes 150°C (300°F): 20 minutes 170°C (338°F): 10 minutes
Cure speed (induction)	<2 minutes

Typical Performance of Cured Adhesive

Shear strength* (ISO4587)	Steel: 20-25 N/mm² (2900-3600 psi) Ferrite: >14 N/mm² (>2000 psi)
Tensile strength (ASTM D2095)	29-35 N/mm² (4200-5000 psi)
Hardness (ISO868)	>75 Shore D
Impact strength (ASTM D950)	25-35 KJ/m²

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Chip Molding in Semiconductor

https://prostech.ph/chip-molding-in-semiconductor/

Challenges SolutionsLiquid encapsulantsEpoxy molding compound Challenges Solutions Liquid encapsulants Encapsulants are the last piece of the IC package and serve

FAQs of Epoxy Mounding Compound

https://prostech.ph/faqs-of-epoxy-mounding-compound/

What do we mean by good electrical stability?What causes poor electrical stability in mold compounds?EMC subcomponents have high ionic contentEpoxy

PERMABOND ES568 Single-part, heat-cure Epoxy

Chip Molding Compound

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