PERMABOND® ES569
PERMABOND® ES569 is a single-part, heat-cured epoxy adhesive that provides excellent bond strength to metals and composites. It is non-sagging, making it ideal for vertical applications and gap filling. It also performs well in electronic assemblies and withstands solder reflow.
PERMABOND® ES569 Features:
- Excellent adhesive strength
- Excellent resistance to vibration
- No mixing required
- High shear and peel strength
- High temperature resistance
- Good chemical resistance
- Non-sag, thixotropic formula
PERMABOND® ES569 Applications:
- Vertical bonding of metals and composites
- Electronic component bonding
- Gap-filling in structural assemblies
- Reflow process-compatible assemblies
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
Chemical composition | Epoxy Resin |
Appearance | Black paste |
Viscosity @ 25°C | 250,000 to 500,000 mPa.s (cP) |
Specific gravity | 1.2 |
Typical Curing Properties
Flow at high temperature | No flow, high wet strength |
Maximum gap fill | 5 mm 0.2 in |
Cure speed (oven) * | 130° C (266°F): 75 minutes 150°C (300°F): 60 minutes 170°C (338°F): 40 minutes |
Cure speed (induction) | <3 minutes |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Steel 27 – 41 N/mm² (4000 – 6000 psi) Aluminium 17 - 31 N/mm² (2500 – 4500 psi) Zinc 14 - 27 N/mm² (2000 – 4000 psi) FRP Glass/Epoxy 9-11 N/mm² (1300–1600psi) Carbon Fibre 10-12 N/mm² (1450–1700psi) |
Peel strength (aluminium) (ISO 4578) |
100-120 N/25mm |
Hardness (ISO868) | 80-85 Shore D |
Coefficient of thermal expansion | 90 x 10-6 mm/mm/°C (under Tg) 180 x 10-6 mm/mm/°C (above Tg) |
Thermal conductivity | 0.5 W/(m.K) |
Glass transition temperature (Tg – DSC) |
130°C (266°F) |
