PERMABOND® ES578
PERMABOND® ES578 is a single-part, heat-curing epoxy adhesive designed for thermal conductivity and flame-retardant applications. It is ideal for bonding aluminum heat sinks and other components requiring heat dissipation and UL94 V-0 compliance.
PERMABOND® ES578 Features:
- Very good thermal conductivity
- Excellent resistance to vibration
- No mixing required
- High shear and peel strength
- High temperature resistance
- Good chemical resistance
- Electrically insulating
PERMABOND® ES578 Applications:
- Bonding aluminum heat sinks
- Thermally conductive structural assemblies
- Flame-retardant component bonding
- Ceramic and composite electronics
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
|
Chemical composition |
Epoxy Resin |
|
Appearance |
Black |
|
Viscosity @ 25°C |
600,000 to 800,000 mPa.s (cP) |
|
Specific gravity |
1.6 |
Typical Curing Properties
|
Flow at high temperature |
Flowing |
|
Maximum gap fill |
5 mm 0.2 in |
|
Cure speed (oven) * |
130° C (266°F): 75 minutes 150°C (300°F): 60 minutes 170°C (338°F): 25 minutes |
|
Cure speed (induction) |
<3 minutes |
Typical Performance of Cured Adhesive
|
Shear strength* (ISO4587) |
Steel 27 – 41 N/mm² (4000 – 6000 psi) Aluminium 17 - 31 N/mm² (2500 – 4500 psi) Zinc 14 - 27 N/mm² (2000 – 4000 psi) |
|
Hardness (ISO868) |
80-85 Shore D |
|
Coefficient of thermal expansion |
45 x 10-6 mm/mm/°C (below Tg) |
|
Thermal conductivity |
1.0 W/(m.K) |
|
Dielectric strength |
40-45 kV/mm |
|
Glass transition temperature (Tg – DSC) |
105°C (220°F) |
