PERMABOND® ES579
PERMABOND® ES579 is a single-part, heat-cured epoxy adhesive offering strong bonding to metals, ceramics, and composites. It provides excellent thermal conductivity while remaining electrically insulating, making it ideal for thermally managed electronics.
PERMABOND® ES579 Features:
- Very high shear, impact, and peel strength
- Excellent vibration resistance
- No mixing required
- High temperature resistance
- Good chemical resistance
- Electrically insulating
PERMABOND® ES579 Applications:
- Electronics bonding
- Thermal management assemblies
- Composite and metal joining
- High-performance structural bonds
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
|
Chemical composition |
Epoxy Resin |
|
Appearance |
Ivory |
|
Viscosity @ 25°C |
60,000 to 90,000 mPa.s (cP) |
|
Specific gravity |
1.7 |
Typical Curing Properties
|
Flow at high temperature |
Some flow |
|
Maximum gap fill |
2 mm 0.08 in |
|
Cure speed (oven) * |
100° C (210°F): 240 minutes 120°C (250°F): 60 minutes 150°C (300°F): 45 minutes 180°C (356°F): 20 minutes |
|
Cure speed (induction) |
<3 minutes |
Physical Properties of Uncured Adhesive
|
Chemical composition |
Epoxy Resin |
|
Appearance |
Ivory |
|
Viscosity @ 25°C |
60,000 to 90,000 mPa.s (cP) |
|
Specific gravity |
1.7 |
Typical Curing Properties
|
Flow at high temperature |
Some flow |
|
Maximum gap fill |
2 mm 0.08 in |
|
Cure speed (oven) * |
100° C (210°F): 240 minutes 120°C (250°F): 60 minutes 150°C (300°F): 45 minutes 180°C (356°F): 20 minutes |
|
Cure speed (induction) |
<3 minutes |
