PERMABOND® ET5003
PERMABOND® ET5003 is a fast-curing, two-part thixotropic epoxy adhesive developed primarily for repairing metal substrates. It provides strong shear strength and is ideal for applications requiring minor gap filling, sanding, and painting.
PERMABOND® ET5003 Features:
- Easy to apply
- High shear strength
- Fast setting
- Full cure at room temperature
- Sandable and paintable shortly after application
PERMABOND® ET5003 Applications:
- Metal part repair
- Maintenance bonding and gap filling
- Structural repairs
- Post-curing surface finishing
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
| ET5003 A-side | ET5003 B-side |
Chemical composition | Epoxy Resin | Mercaptan Hardener |
Appearance | Silver-grey | Black |
Viscosity @ 25°C | 190,000 mPa.s (cP) Thixotropic | 54,000 mPa.s (cP) Thixotropic |
Specific gravity | 1.4 | 1.5 |
Typical Curing Properties
Mix ratio | 1:1 by volume |
Maximum gap fill | 2 mm 0.08 in |
Gel time @23°C | 20g: 5 mins |
Handling Time | 23°C: 12-15 mins |
Working Strengh | 23°C: 30-60 mins |
Full cure | 23°C: 24 hours |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Mild Steel: 20-24 N/mm² (2900-3480psi) Aluminium: 16-19 N/mm² (2320-2760psi) Stainless Steel: 23-26 N/mm² (3340-3770psi) |
Hardness (ISO868) | 65 Shore D |
Compressive strength (ASTM D695) | 60 MPa |
