PERMABOND® ET505
PERMABOND® ET505 is a two-part, 1:1 mixable epoxy adhesive that forms semi-flexible, tough bonds with a range of materials including wood, metals, ceramics, plastics, and composites. It features high peel and shear strength, excellent chemical resistance, and an extended work life ideal for large-scale applications.
PERMABOND® ET505 Features:
- Adhesion to a wide variety of substrates
- Full cure at room temperature
- Easy to apply
- High shear and peel strength
- Good impact strength
- Good chemical resistance
PERMABOND® ET505 Applications:
- Bonding large surface areas
- Assembly of mixed-material parts
- Impact- and vibration-resistant joints
- Structural bonding in industrial settings
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
|
|
ET505A |
ET505B |
|
Chemical composition |
Epoxy Resin |
Amine Hardener |
|
Appearance |
Colourless |
Amber |
|
Viscosity @ 25°C |
14,000-28,000 mPa.s (cP) |
10,000-25,000 mPa.s (cP) |
|
Specific gravity |
1.1 |
1.0 |
Typical Curing Properties
|
Mix ratio by volume |
1:1 |
|
Maximum gap fill |
2 mm 0.08 in |
|
Usable / pot life @23°C |
1-2 hours |
|
Handling time @23°C |
3-5 hours |
|
Working strength @23°C |
24 hours |
|
Full cure @23°C |
72 hours |
Typical Performance of Cured Adhesive
|
Shear strength (mild steel)* (ISO4587) |
18-21 N/mm² (2600 -3000 psi) |
|
Peel strength (aluminium) (ISO4578) |
60-80 N/25mm (13-18PIW) |
|
Hardness (ISO868) |
65-75 Shore D |
|
Elongation at break (ISO37) |
5-10% |
|
Glass transition temperature Tg |
40-50°C (104-122°F) |
|
Dielectric strength |
15-25 kV/ mm |
|
Thermal conductivity |
0.35 W/(m.K) |
