PERMABOND® ET5143
PERMABOND® ET5143 is a two-part, thixotropic epoxy adhesive with excellent resistance to impact and vibration. Its controlled flow characteristics make it ideal for gap-filling applications, and it is formulated with FDA-compliant ingredients for select food-contact assemblies.
PERMABOND® ET5143 Features:
- Adhesion to a wide variety of substrates
- Full cure at room temperature
- FDA compliant formulation
- High shear and peel strength
- Good impact strength
PERMABOND® ET5143 Applications:
- Gap-filling structural bonds
- Food and beverage equipment bonding
- Metal and plastic component assembly
- Vibration-resistant industrial joints
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
| ET5143A | ET5143B |
Chemical composition | Epoxy Resin | Polyamine Hardener |
Appearance | White | Black |
Viscosity @ 25°C | 20rpm: 50,000- 80,000 mPa.s (cP) 2rpm: 200,000- 300,000 mPa.s (cP) | 20rpm: 100,000- 200,000 mPa.s (cP) 2rpm: 200,000- 300,000 mPa.s (cP) |
Specific gravity | 1.3 | 1.3 |
Typical Curing Properties
Mix ratio by volume | 1:1 |
Maximum gap fill | 2 mm 0.08 in |
Usable / pot life @23°C 1+1g | 60-80 mins |
Handling time @23°C | 3-5 hours |
Working strength | @23°C: 16 hours @60°C: 30 minutes |
Full cure | @23°C: 72 hours @60°C: 1 hour |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Mild steel: 18-22 N/mm² (2600 -3200 psi) Stainless steel: 12-15 N/mm² (1750 -2200 psi) Aluminium: 10-14 N/mm² (1450 -2000 psi) |
Peel strength (aluminium) (ISO4578) | 30-50 N/25mm (7-11 PIW) |
Hardness (ISO868) | >75 Shore D |
Glass transition temperature Tg | 40-50°C (104-122°F) |
Dielectric strength | 15-25 kV/ mm |
