PERMABOND® ET538
PERMABOND® ET538 is a structural epoxy adhesive that cures at room temperature and provides excellent adhesion to materials such as wood, metal, ceramics, and plastics. Its non-slump rheology makes it suitable for vertical and gap-filling applications, while its chemical resistance suits demanding environments.
PERMABOND® ET538 Features:
- Adhesion to a wide variety of substrates
- Full cure at room temperature
- Easy to apply
- High shear and peel strength
- Good impact strength
- Good chemical resistance
- Non-drip rheology
PERMABOND® ET538 Applications:
- Automotive and industrial assemblies
- Batch production processes
- Chemical-resistant bonding
- Vertical or gap-filling applications
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
| ET538 A side | ET538 B side |
Chemical composition | Epoxy Resin | Polyamine Hardener |
Appearance | White | Dark grey |
Viscosity @ 25°C | 20rpm: 75,000 mPa.s (cP) 2.5rpm: 225,000 mPa.s (cP) | 20rpm: 30,000 mPa.s (cP) 2rpm: 60,000 mPa.s (cP) |
Specific gravity | 1.1 | 1.4 |
Typical Curing Properties
Mix ratio | 1:1 by volume 100:130 by weight |
Maximum gap fill | 5 mm 0.2 in |
Usable / pot life @23°C | 120-150 mins |
Handling time @23°C | 3-5 hours |
Working strength @23°C | 24 hours |
Full cure @23°C | 72 hours |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Mild steel: 25-30 N/mm² (3625-4350psi) Aluminium: 22-26 N/mm² (3190-3770psi) Stainless Steel: 28-32 N/mm² (4060-4640psi) Zinc: 17-20 N/mm² (2500 - 2900 psi) Carbon Fibre: 20-24 N/mm² (2900-3480psi) FRP Glass/Polyester: 6-8 N/mm² (870-1160psi) FRP Glass/Epoxy: 18-22 N/mm² (2610-3190psi) Polycarbonate: 3-5 N/mm² (435-725psi) PA6 30% filled: 3-5 N/mm² (435-725psi) |
Peel strength (aluminium) (ISO4578) | 60-80 N/25mm (13-18 PIW) |
Hardness (ISO868) | 70-80 Shore D |
Elongation at break (ISO37) | 4-8% |
Glass transition temperature Tg | 45-55°C (113-131°F) |
Dielectric strength | 15-25 kV/ mm |
Thermal conductivity | 0.55 W/(m.K) |
