PERMABOND® ET540
PERMABOND® ET540 is a semi-flexible, two-part epoxy adhesive with a 2:1 mix ratio and no-slump consistency. It adheres well to wood, metal, ceramics, and select plastics, offering long open time for large-scale bonding and high resistance to impact and temperature.
PERMABOND® ET540 Features:
- Adhesion to a wide variety of substrates
- Full cure at room temperature
- Easy to apply
- High shear and peel strength
- Good impact strength
- High temperature resistance
- Non-drip rheology
PERMABOND® ET540 Applications:
- Large surface bonding
- Multi-material joints
- Temperature-resistant assemblies
- Structural repair work
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
Physical Properties of Uncured Adhesive
|
|
ET540 A side |
ET540 B side |
|
Chemical composition |
Epoxy Resin |
Polyamine Hardener |
|
Appearance |
White |
Amber |
|
Viscosity @ 25°C |
20rpm: 75,000 mPa.s (cP) 2rpm: 225,000 mPa.s (cP) |
20rpm: 150,000 mPa.s (cP) 2rpm: 500,000 mPa.s (cP) |
|
Specific gravity |
1.1 |
1.0 |
Typical Curing Properties
|
Mix ratio by volume |
2:1 |
|
Maximum gap fill |
5 mm 0.2 in |
|
Usable / pot life @23°C |
120-150 mins |
|
Handling time @23°C |
150-180 mins |
|
Working strength @23°C |
24 hours |
|
Full cure @23°C |
72 hours |
Typical Performance of Cured Adhesive
|
Shear strength* (ISO4587) |
Mild steel: 22-26 N/mm² (3190-3770psi) Aluminium: 20-24 N/mm² (2900-3480psi) Stainless Steel: 32-35 N/mm² (4640-5075psi) Carbon Fibre: >25 N/mm² ** SF (>3625psi) FRP Glass/Polyester: >8 N/mm²** SF (>1160psi) FRP Glass/Epoxy: 23-27 N/mm² (3335-3915psi) PEEK: 2-3 N/mm² (290-435psi) Polycarbonate: 2-4 N/mm² (290-580psi) PA6 30% filled: 3-5 N/mm² (435-725psi) |
|
Peel strength (aluminium) (ISO11339) |
60-80 N/25mm (13-18 PIW) |
|
Hardness (ISO868) |
60-75 Shore D |
|
Elongation at break (ISO37) |
4-8% |
|
Glass transition temperature Tg |
45-55°C (113-131°F) |
|
Dielectric strength |
15-25 kV/ mm |
|
Thermal conductivity |
0.55 W/(m.K) |
