PERMABOND® ET5401
PERMABOND® ET5401 is a toughened, semi-flexible epoxy adhesive with no-slump rheology and a 2:1 mix ratio. It forms strong bonds on a variety of substrates and demonstrates enhanced performance when cured at high temperatures or exposed to thermal processes.
PERMABOND® ET5401 Features:
- Adhesion to a wide variety of substrates
- Full cure at room temperature
- Easy to apply
- High shear and peel strength
- Good impact strength
- High temperature resistance
- Non-drip rheology
PERMABOND® ET5401 Applications:
- High-performance structural bonding
- Thermal cycle-resistant joints
- Multi-substrate assemblies
- Paint-stoving or high-temp cured parts
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Typical Properties
Physical Properties of Uncured Adhesive
|
|
ET5401A |
ET5401B |
|
Chemical composition |
Epoxy Resin |
Polyamine Hardener |
|
Appearance |
White |
Black |
|
Viscosity @ 25°C |
20rpm: 60,000- 120,000 mPa.s (cP) 2.5rpm: 250,000- 450,000 mPa.s (cP) |
20rpm: 50,000- 100,000 mPa.s (cP) 2.5rpm: 150,000- 250,000 mPa.s (cP) |
|
Specific gravity |
1.2 |
1.1 |
Typical Curing Properties
|
Mix ratio by volume |
2:1 |
|
Maximum gap fill |
5 mm 0.2 in |
|
Usable / pot life @23°C |
10-12 mins |
|
Handling time @23°C (to 1 N/mm²) |
60-90 mins |
|
Working strength @23°C |
24-48 hours |
|
Full cure @23°C |
4-7 days |
Typical Performance of Cured Adhesive
|
Shear strength (grit blasted mild steel)* ISO 4587 Cured 25°C for 7 days |
10-15 N/mm² (1450-2200 psi) |
|
Shear strength ISO 4587 Cured 80°C for 1 hour |
Mild steel 20-30 N/mm² (2900-4400 psi) Aluminium 20-25 N/mm² (2900-3600 psi) FRP Glass Polyester: 6-8 N/mm² (900-1200psi) FRP Glass Epoxy: 19-23 N/mm² (2800-3300psi) Carbon Fibre: 22-24 N/mm² (3200-3500psi) |
|
Peel Strength (aluminium)* Cured 80°C for 1 hour |
140-160 N/25mm (31-35 PIW) |
|
Peel Strength (aluminium)* Cured 200°C for 15 mins |
250-300 N/25mm (55-66 PIW) |
|
Hardness (ISO868) |
65-75 Shore D (cured at 25°C) 75-85 Shore D (cured for 1hr at 80°C) |
|
Elongation at break (ISO37) |
4-8% |
|
Glass transition temperature Tg |
Heat cured: 110°C (230°F) Room temp. cure: 50°C (122°F) |
|
Dielectric strength |
15-25 kV/ mm |
