PERMABOND® ET5422
PERMABOND® ET5422 is a two-part, thixotropic epoxy adhesive designed for tough, high-strength applications. With excellent resistance to impact and vibration, it is ideal for gap-filling and maintains strong performance even at elevated temperatures.
PERMABOND® ET5422 Features:
- Easy to apply
- High shear and peel strength
- Long open time
- High temperature resistance
PERMABOND® ET5422 Applications:
- Structural bonding in high-stress environments
- Gap filling in composite assemblies
- Vibration-resistant joints
- High-temperature industrial applications
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
|
|
ET5422 A-side |
ET5422 B-side |
|
Chemical composition |
Epoxy Resin |
Modified Polyamide |
|
Appearance |
Off White |
Blue |
|
Viscosity @ 25°C |
20rpm: 105,000 mPa.s (cP) Thixotropic |
20rpm: 100,000 mPa.s (cP) Thixotropic |
|
Specific gravity |
1.14 |
1.00 |
Typical Curing Properties
|
Mix ratio |
2:1 by volume 100:44 by weight |
|
Maximum gap fill |
5 mm 0.2 in |
|
Usable / pot life @23°C |
10g: 3 hours 200g: 1 hour |
|
Handling Time |
23°C: 16 hours |
|
Working Strength |
23°C: 24 hours |
|
Full cure |
23°C: 5 days 82°C: 1 hour |
Typical Performance of Cured Adhesive
|
Shear strength* (ISO4587) |
Aluminium: 30-40 N/mm² (4350-5800psi) Mild Steel: 30-38 N/mm² (4350-5510psi) Stainless Steel: 20-26 N/mm² (2900-3770psi) Hot Dip Galv: 18-24 N/mm² (2610-3480psi) Carbon Fibre: >22 N/mm² (>3190psi) SF** Epoxy GFRP: >20 N/mm² (>2900psi) SF** Polyester GRP: >10 N/mm² (>1450psi) SF** |
|
Peel strength (aluminium) (ISO4578) |
Cured 1hr @ 60°C: 270 N/25mm (59 PIW) Cured 5 days @ 23°C: 320 N/25mm (70 PIW) |
|
Tg (DSC) 5d @ 23°C |
60°C (140°F) |
|
Tg (DSC) 3d @ 23°C + 60min @ 80°C |
115°C (239°F) |
|
Impact strength (ASTM D-950) |
20-30 KJ/m² |
|
Hardness (ISO868) |
>80 Shore D |
