PERMABOND® ET5429
PERMABOND® ET5429 is a two-part thixotropic epoxy adhesive engineered for structural bonding of composites. Its controlled flow properties, excellent temperature performance, and impact resistance make it ideal for vertical or gap-filling applications in high-performance assemblies.
PERMABOND® ET5429 Features:
- Excellent bonding for composites
- High shear and peel strength
- Easy to apply
- Impact and vibration resistance
- Performs well at high temperatures
PERMABOND® ET5429 Applications:
- Composite structure bonding
- High-load-bearing joints
- Aerospace and transport applications
- Vertical or large-gap adhesives
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
| ET5429 A side | ET5429 B side |
Chemical composition | Epoxy Resin | Polyamine Hardener |
Appearance | White | Black |
Mixed appearance | Charcoal black | |
Viscosity @ 25°C | 20rpm: 200,000 mPa.s (cP) 2rpm: 300,000 mPa.s (cP) | 20rpm: 60,000 mPa.s (cP) 2rpm: 150,000 mPa.s (cP) |
Specific gravity | 1.0 | 1.0 |
Typical Curing Properties
Mix ratio | 2:1 by volume 2:1 by weight |
Maximum gap fill | 5 mm 0.2 in |
Usable / pot life @23°C 10g mixed | 2-4 hours |
Handling time | 23°C: 6-10 hours |
Working strength | 23°C: 24 hours 60°C: 1 hour |
Full cure | 23°C: 72 hours 60°C: 2 hours |
Typical Performance of Cured Adhesive
Shear strength* (ISO4587) | Mild Steel: 23-28 N/mm² (3335-4060psi) Aluminium: 26-31 N/mm² (3770-4495psi) Stainless Steel: 25-30 N/mm² (3625-4350psi) Carbon Fibre: >25 N/mm² ** SF (>3625psi) FRP Glass/Polyester: >6 N/mm²** SF (>870psi) FRP Glass/Epoxy: 18-22 N/mm² (2610-3190psi) PEEK: 4-5 N/mm² (580-725psi) PA6 30% filled: 4-6 N/mm² (580-870psi) PVC: >3 N/mm² ** SF (>435psi) Polycarbonate: 3-4 N/mm² (435-580psi) |
Peel strength (aluminium) (ISO4578) |
150-230 N/25mm (33-51 PIW) |
Impact strength (ASTM D-950) | 30-40 KJ/m² |
Hardness (ISO868) | 65-75 Shore D |
Elongation at break (ISO37) | <5% |
Glass transition temperature Tg | 50-60°C (122-140°F) |
Dielectric strength | 15-25 kV/ mm |
