PERMABOND® ET5441
PERMABOND® ET5441 is a thermally conductive, two-part epoxy adhesive formulated for high-temperature applications. It offers excellent chemical resistance and adheres well to metals and other challenging substrates.
ET5441 Features:
- Thermally conductive and high-temperature resistant
- Full cure at room temperature or accelerated at 80°C
- Excellent resistance to oil, glycol, and water
- Flammability rating UL94 HB
- Compliant with ECSS-Q-ST-70-02 thermal vacuum test
ET5441 Applications:
- Bonding of metal substrates in thermal environments
- Electronics exposed to oils and coolant
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Typical Properties
Physical Properties of Uncured Adhesive
| ET5441A | ET5441B | |
| Chemical composition |
Epoxy Resin | Amine Hardener |
| Appearance | White | Dark Grey |
| Viscosity @ 23°C* | 25,000 mPa.s (cP) Thixo |
22,000 mPa.s (cP) Thixo |
| Specific gravity | 2.1 | 2.1 |
Typical Curing Properties
| Mix ratio | 2:1 by weight 2:1 by volume |
| Maximum gap fill | 2 mm 0.08 in |
| Usable / pot life @23°C (77°F) | 150 minutes |
| Working strength @23°C (77°F) | 8 hours |
| Full cure | 23°C (77°F): 7 days 80°C (176°F): 2 hours |
Typical Performance of Cured Adhesive
| Shear strength* (ISO4587) |
Steel: 20-25 N/mm² (2900-3625 psi) Aluminium: 17-21 N/mm² (2465-3045 psi) Stainless Steel: 20-25 N/mm² (2900-3625 psi) Carbon Fibre: 25-30 N/mm² (3625-4350 psi) GRP (Glass/Polyester): >10 N/mm² ** (>1450 psi) FRP (Glass/Epoxy): >19 N/mm² ** (>2755 psi) ABS: >6 N/mm² ** (>870 psi) Polycarbonate: 2-4 N/mm² (290-580 psi) |
| Tensile strength at break (DIN 53504) |
50 N/mm² (7250 psi) |
| Elongation at Break |
2.9% |
| Hardness (ISO868) | 85-95 Shore D |
| Tg (DSC) 7d @ 23°C | 65°C (149°F) |
| Tg (DSC) 24h@ 23°C + 30min @80°C |
113°C (235°F) |
| Coefficient of thermal expansion |
Below Tg: 23 x 10-6 /K Above Tg: 111 x 10-6 /K |
| Thermal Conductivity (ISO 8302) |
1.1 W/(m.K) |
