Product Introduction
Permabond® HL138 is a single-component liquid adhesive that cures only when in contact with metal parts and when oxygen is excluded. It fills the “air space” between parts and eliminates wear, erosion, and pitting, making it ideal for high-speed production lines.
PERMABOND® HL138 Features
- Simple one-part fast cure low viscosity system
- Excellent shear strength
- Good environmental resistance
PERMABOND® HL138 Applications
- Shaft-hub assemblies with clearance fits
- High-speed production line bonding
- Applications requiring environmental resistance
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Physical Properties of Uncured Adhesive
|
Chemical composition |
Acrylic |
|
Appearance |
Green |
|
Viscosity @ 25°C |
150-300 mPa.s (cP) |
|
Specific Gravity |
1.1 |
|
UV fluorescence |
No |
Typical Curing Properties
|
Maximum gap fill Maximum thread size |
0.127 mm 0.005 in M20 ¾" |
|
Time taken to reach handling strength (M10 steel) @23°C |
10 minutes* |
|
Time taken to reach working strength (M10 steel) @23°C |
3 hours |
|
Full strength (M10 steel) @23°C |
24 hours |
Typical Performance of Cured Adhesive
|
Torque strength (M10 steel ISO10964) |
Break 20 N·m 180 in.lb Prevail 36 N·m 315 in.lb |
|
Shear strength (steel collar & pin ISO10123) |
16 MPa 2300 psi |
|
Coefficient of thermal expansion |
90 x 10-6 mm/mm/°C |
|
Dielectric strength |
11 kV/mm |
|
Thermal conductivity |
0.19 W/(m.K) |
