Potting Compound is the most important element that takes a tremendous effect on the performance of the potting layer.
According to the chemical base, potting compound could be classified as follows:
1. Epoxy
Epoxy Potting Compound or called Epoxy Resins have been widely used for many years since the early days due to its characteristics of:
♦ Excellent level of mechanical properties
♦ Good pretty high-temperature performance
♦ Good adhesion to a wide variety of substrate
♦ Show excellent chemical resistance
In general, Epoxy Resins are suitable for almost applications that do not have a specific requirement in very high-temperature resistance (>180C) and flexibility.
2. Silicone
Silicone Potting Compounds are specially used where high and or low continuous operating temperatures (-50C to 200C) are involved.
In addition to, due to their inherently high flexibility makes these resins particularly suitable for applications where there is a high level of shock involved or a high frequency of thermal cycling.
Silicones also have excellent adhesion to a wide range of substrates, including most common metals and plastic, make them more ideal in many applications in LED and electronic industry.
3. Polyurethane
Polyurethane or urethane resins are elastomeric or rubbery in their cured state and are preferred where potted parts contain dedicated components.
Although polyurethane could only be used in the applications that temperate is not over 125C, it is the perfect balance of mechanical strength and flexibility.
Moreover, it is much easier to tailor the cure speed with urethane systems and the usable life and gel time of these can be adjusted to suit customer requirements, leading to faster process times and less work in progress.
So how to choose the right type of potting compound for your applications? It depends on your inquiry about its capacity of resistance in some specific environment and its cost also. Please refer the following table for more information:
Type |
Epoxy |
PU |
Silicone |
High Temp Resistance |
Good |
Poor |
Good |
Chemical Resistance |
Good |
Poor |
Poor |
Thermal Conductivity |
Good |
Poor |
Good |
Thermal Shock |
Fair |
Good |
Good |
Processability |
Poor |
Good |
Good |
Flexibility |
Poor |
Good |
Good |
Thermal Expansion |
Good |
Poor |
Poor |
Electrical Insulation |
Good |
Poor |
Fair |
Plastic Adhesion |
Poor |
Good |
Fair |
Cost |
Fair |
Low |
High |
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