Component Reinforcement

Impregnating resin

Abrasives

Our Abrasive Solutions offer a comprehensive range of products designed for precision grinding, cutting, blending, finishing, and surface preparation across

Activator, Initiator & Accelerator

Compounds & Polishes

Electronic Component Reinforcement

Electronic Staking

Electronics Auxiliary Chemicals

Flexible Laminates

Immersion Cooling Fluids

Lubricant

Other Industrial Materials

Tape Converter Machine

Thinner Liquid

Low Pressure Molding System

Low Pressure Molding Machines Low Pressure Molding Machines (LPM) are specialized equipment designed for the effcient encapsulation and protection of

Sealant & Gasketing Liquid

Adhesives

PROSTECH has solutions to bond whatever you want. With a professional engineer team having experience in the adhesive industry and

Tape

Together with adhesive, Tape is another premium bonding material in the future. Tape possess not only high strength bonding ability

Thermal Management

PROSTECH offers thermal management solutions and innovations for the next generation of electronics. Thermal interface materials are currently growing rapidly

Soldering

Soldering Material is now a familiar term with electronics manufacturers as it is an indispensable material in fabrication. There are

Dispensing System

Due to the significant development of automation in the manufacturing process, DISPENSING SYSTEM is now becoming an indispensable element directly

Conformal Coatings

A conformal coating is a thin polymeric film applied to a printed circuit board (PCB) to protect the board and

Curing System

Plasma Treatment

Low Pressure Molding Material

Low Pressure Molding Materials are used for Low Pressure Molding (LPM) process that encapsulates and protects electronic components from environmental

Potting - Encapsulant

Using potting compounds for practical electronics potting to protect against environmental influences improves mechanical strength and high electrical insulation. Potting

Primer and Adhesion Promoter

Pros Technology provides a line of adhesion promoter and primer to improve the adhesion strength on difficult to bond substrates.

Elastomeric materials

Masking

Cleaner Degreaser

Labelling Printing

Robotic & Automation

Maintain and Repair

Metrology Equipment

Insulation

EMI Shielding

Specific Coating