Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pins in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing, or syringe; then the components are put in place by a pick-and-place machine or by hand.
Along with the development of soldering techniques, there are numerous kinds of solder paste. Please refer to our solder paste product for more information.
