Heat Spreader

Heat Spreader is a thin thermal component that provides a low-cost, effective means of cooling IC devices in restricted spaces, where conventional heat sinks are inappropriate.
Our Heat Spreader consists of flexible copper foil between electrically insulating films with high strength acrylic PSA which helps to provide a strong bond to the component.
The compliant nature of these heat spreaders permits nearly 100% adhesive contact with non-flat package surfaces, optimizing thermal and mechanical performance.