Product Introduction
Bergquist TGF 3010APS Gap Filler is a silicone-free thermal interface material that cures at room temperature, offering excellent thermal conductivity of 3.0 W/m-K. Ideal for lithium-ion battery applications, automotive energy storage, and consumer electronics, this material provides efficient heat transfer and is designed to minimize compressive stress during assembly.
3010APS Features:
- Thermal conductivity of 3.0 W/m-K for superior heat transfer.
- Silicone-free formulation for sensitive applications.
- Cures at room temperature without the need for an oven.
- High dispensing rate of >40 cc/sec.
- Low compressive stress during assembly to ensure component integrity.
3010APS Applications:
- Automotive energy storage applications.
- Silicone-sensitive applications requiring efficient heat transfer.
- High thermal conductivity needs in consumer electronics.
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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| Property | BERGQUIST GAP FILLER TGF 3010APS (A) | BERGQUIST GAP FILLER TGF 3010APS (B) |
|---|---|---|
| Viscosity, mPa·s (cP) | ||
| High shear rate 3000 s⁻¹, ASTM D5099 | 5,000 | 20,000 |
| Low shear rate 1.0 s⁻¹, DIN 53019 | 425,000 | 650,000 |
| Density, ASTM D792, g/cc | 3.0 | 3.0 |
| Shelf life @ 25°C, days | 90 | 90 |
Cured Material Properties
Physical Properties
| Property | Value |
|---|---|
| Hardness, Shore 00, 6.35 mm (thick sample) | 75 |
| Specific heat capacity, ASTM D1269, J/g-K | 0.87 |
| Flammability, UL 94 | V-0 |
| Siloxane content, ΣD4-D10, ASTM F2466, ppm | ND |
Electrical Properties
| Property | Value |
|---|---|
| Dielectric strength, ASTM D149, V/mm | 14,000 |
| Dielectric constant, ASTM D150 @ 1000 Hz | 17 |
| Volume resistivity, ASTM D257, ohm-meter | 1×10⁶ |
Thermal Properties
| Property | Value |
|---|---|
| Thermal conductivity, ASTM D5470, W/(m-K) | 3.0 |
