LiPOLY PK504 Thermal Conductive Gel Pad
LiPOLY PK504 is a soft, compressible thermal gel pad with a thermal conductivity of 5.0 W/m*K. Engineered for ease of use and manufacturing, its tacky surface ensures secure placement, making it ideal for electronic device assembly and custom applications.
PK504 Features
- Thermal conductivity: 5.0 W/m*K
- Naturally tacky for efficient assembly
- High flexibility and insulation
- Low thermal impedance
- Available in custom thicknesses and shapes
PK504 Applications
- Notebook computers
- Memory modules and heat pipes
- TVs and mobile devices
- EV electronics and infrastructure
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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PROPERTY | PK504 | TEST METHOD | UNIT |
Color | Gray | Visual | - |
Surface tack 2-side/1-side | 2 | - | - |
Thickness | Customized | ASTM D374 | mm |
Density | 3.0 | ASTM D792 | g/cm³ |
Hardness | 50 | ASTM D2240 | Shore OO |
Application temperature | -60~180 | - | °C |
ROHS & REACH | Compliant | - | - |
COMPRESSION@1.0mm | |||
Deflection @10 psi | 13 | ASTM D5470 modify | % |
Deflection @20 psi | 17 | ASTM D5470 modify | % |
Deflection @30 psi | 22 | ASTM D5470 modify | % |
Deflection @40 psi | 27 | ASTM D5470 modify | % |
Deflection @50 psi | 31 | ASTM D5470 modify | % |
ELECTRICAL | |||
Dielectric breakdown | 12 | ASTM D149 | KV/mm |
Surface resistivity | >10¹¹ | ASTM D257 | Ohm |
Volume resistivity | >10¹⁰ | ASTM D257 | Ohm-m |
THERMAL | |||
Thermal Conductivity | 5.0 | ASTM D5470 | W/m*K |
Thermal impedance@10 psi | 0.415 | ASTM D5470 | °C-in²/ W |
Thermal impedance@20 psi | 0.393 | ASTM D5470 | °C-in²/ W |
Thermal impedance@30 psi | 0.358 | ASTM D5470 | °C-in²/ W |
Thermal impedance@40 psi | 0.336 | ASTM D5470 | °C-in²/ W |
Thermal impedance@50 psi | 0.307 | ASTM D5470 | °C-in²/ W |
