LiPOLY SH-putty3 Thermal Conductive Putty
LiPOLY SH-putty3 is a high-performance, one-part thermal putty with 8.0 W/m*K conductivity. It is optimized for high-deformation filling and serial production environments, making it an ideal replacement for thermal grease.
SH-putty3 Features
- Thermal conductivity: 8.0 W/m*K
- Bond line thickness: 100–3000µm
- Designed to eliminate air gaps and tolerance issues
- No vertical flow
- Suitable for sensitive components
- Dispensable for mass production
SH-putty3 Applications
- Between CPU and heatsink
- Flat-panel displays and IP CAMs
- Set-top boxes
- 5G and telecom systems
- EV and automotive electronics
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
|
PROPERTY |
SH-putty3 |
TEST METHOD |
UNIT |
|
Color |
Gray |
Visual |
- |
|
Resin base |
Silicone |
- |
- |
|
Viscosity |
17000 |
DIN 53018 |
Pa.s |
|
Density |
3.4 |
ASTM D792 |
g/cm³ |
|
Application temperature |
-60~180 |
- |
°C |
|
Bond line thickness |
100~3000 |
- |
μm |
|
Shelf life |
60 months |
- |
- |
|
ROHS & REACH |
Compliant |
- |
- |
|
ELECTRICAL |
|||
|
Dielectric breakdown |
12 |
ASTM D149 |
KV/mm |
|
Volume resistivity |
>10¹³ |
ASTM D257 |
Ohm-m |
|
THERMAL |
|||
|
Thermal conductivity |
8.0 |
ASTM D5470 |
W/m*K |
|
Thermal impedance@10psi |
0.039 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@30psi |
0.035 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@50psi |
0.031 |
ASTM D5470 |
°C-in²/ W |
