LiPOLY ST6000-S UL Flammability Thermal Conductive Tape
ST6000-S is a UL-rated thermally conductive tape offering 1.8 W/m*K thermal conductivity. It is ideal for bonding heat sinks to power components with excellent heat and pressure resistance.
ST6000-S Features
- Thermal conductivity: 1.8 W/m*K
- UL high temperature stability
- No mechanical clamping required
ST6000-S Applications
- Power supplies and motor controls
- Power semiconductors
- 5G base stations and electric vehicles
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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Typical Properties
|
PROPERTY |
ST6000-S |
TEST METHOD |
UNIT |
|
Color |
White |
Visual |
– |
|
Reinforced layer |
None |
– |
– |
|
Thickness |
0.2 |
ASTM D374 |
mm |
|
Density |
2.3 |
ASTM D792 |
g/cm³ |
|
Application temperature |
-60~180 |
– |
°C |
|
Short time temp. @30sec |
288 |
– |
°C |
|
ROHS |
Compliant |
– |
– |
|
ADHESION |
|||
|
Lap shear strength |
35 |
ASTM D1002 |
N/cm² |
|
Die shear strength@25°C |
50 |
– |
N/cm² |
|
Die shear strength@80°C |
50 |
– |
N/cm² |
|
Holding power 1kg @25°C |
>10000 |
PSTC-7 |
min |
|
Holding power 1kg @80°C |
>10000 |
PSTC-7 |
min |
|
90° Peeling strength @ 25°C, 72 hrs |
>8 |
ASTM D3330 |
N/inch |
|
90° Peeling strength @ Thermal aging |
>7 |
80°C 1000 hrs |
N/inch |
|
90° Peeling strength @ HAST |
>10 |
85°C/85%RH 1000 hrs |
N/inch |
|
90° Peeling strength @ Thermal cycling |
>9.5 |
-40°C~120°C 500 cycles |
N/inch |
|
ELECTRICAL |
|||
|
Dielectric breakdown |
3.5 |
ASTM D149 |
KV |
|
Surface resistivity |
>10⁹ |
ASTM D257 |
Ohm |
|
Volume resistivity |
>10⁹ |
ASTM D257 |
Ohm-m |
|
THERMAL |
|||
|
Thermal conductivity |
1.8 |
ASTM D5470 |
W/m*K |
|
Thermal impedance@5psi |
0.81 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@10psi |
0.72 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@15psi |
0.65 |
ASTM D5470 |
°C-in²/ W |
